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醇酸树脂微胶囊的制备及环氧涂层自修复性能
引用本文:雷瑞,马养民,杨秀芳. 醇酸树脂微胶囊的制备及环氧涂层自修复性能[J]. 化工进展, 2020, 39(7): 2782-2787. DOI: 10.16085/j.issn.1000-6613.2019-1669
作者姓名:雷瑞  马养民  杨秀芳
作者单位:1.陕西科技大学化学与化工学院,陕西 西安 710021;2.陕西省轻化工助剂重点实验室,陕西 西安 710021
基金项目:西安市未央区科技计划;陕西省重点研发计划
摘    要:采用三聚氰胺-脲醛树脂(MUF)为壁材、合成的花椒籽油醇酸树脂为芯材,原位聚合法制备自修复微胶囊,探讨了微胶囊的制备工艺。并采用扫描电子显微镜(SEM)、红外光谱仪(FTIR)、热重分析仪(TGA)和粒径分析仪对微胶囊的表面形貌、化学结构、热稳定性及其粒径分布进行了测试表征。将醇酸树脂微胶囊分散到环氧基体中,研究了环氧涂层的力学性能和自修复性能。实验结果表明,当乳化剂浓度为2.0g/L、芯壁比为2∶1、终点pH为3.5时,微胶囊呈球形结构,无明显的缺陷和损伤,平均粒径为97.44μm,热稳定性良好。当添加质量分数5%的微胶囊时,与未添加微胶囊的自修复涂层相比,其弯曲强度、拉伸强度、黏结强度及其冲击强度分别提高了50.4%、50.0%、40.0%及25.2%,且涂层的自修复性能良好。

关 键 词:环氧树脂  微胶囊  醇酸树脂  修复  聚合物  复合材料  

Self-healing performance of epoxy coating containing microencapsulated alkyd resin
LEI Rui,MA Yangmin,YANG Xiufang. Self-healing performance of epoxy coating containing microencapsulated alkyd resin[J]. Chemical Industry and Engineering Progress, 2020, 39(7): 2782-2787. DOI: 10.16085/j.issn.1000-6613.2019-1669
Authors:LEI Rui  MA Yangmin  YANG Xiufang
Affiliation:1.College of Chemistry and Chemical Engineering, Shaanxi University of Science and Technology, Xi’an 710021, Shaanxi, China
2.Shaanxi Key Laboratory of Chemical Additives for Industry, Xi’an 710021, Shaanxi, China
Abstract:The self-healing microcapsules were prepared by in-situ polymerization with melamine urea formaldehyde resin (MUF) as shell material and Zanthoxylum bungeanum seed oil-based alkyd resin as core material. The surface morphology, chemical structure, thermal stability and size distribution of the microcapsules were characterized by scanning electron microscopy (SEM), Fourier transform infrared spectroscopy (FTIR), thermal gravimetric analysis (TGA) and particle size analyzer. The mechanical and self-healing properties of epoxy coating were investigated by dispersing alkyd microcapsules into epoxy matrix. The microcapsules were uniform sphere with no obvious defects and damages with an average particle size of 97.44μm when the concentration of emulsifier is 2.0g/L and the core/wall was 2∶1 with the end point pH of 3.5. The microcapsules possessed good thermal stability. When the content of microcapsule was 5%, the bending strength, tensile strength, bonding strength and impact strength of the coating were increased by 50.4%, 50.0%, 40.0% and 25.2%, respectively and the self-healing performance of the coating significantly enhanced, as compared with the unmodified one.
Keywords:epoxy resin  microencapsulation  alkyd resin  healing  polymer  composites  
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