| Nd对Sn-0.7Cu-0.05Ni焊点组织与力学性能的影响 |
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| 引用本文： | 刘霜,薛松柏. Nd对Sn-0.7Cu-0.05Ni焊点组织与力学性能的影响[J]. 焊接学报, 2020, 41(1): 50-54. DOI: 10.12073/j.hjxb.20190928002 |
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| 作者姓名： | 刘霜 薛松柏 |
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| 作者单位： | 南京航空航天大学，南京，210016 |
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| 基金项目： | 江苏高校优势学科建设工程资助项目;国家自然科学基金资助项目 |
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| 摘 要： | 研究了添加微量稀土元素Nd对Sn-0.7Cu-0.05Ni/Cu无铅焊点再流焊和150 ℃时效条件下焊点界面组织与力学性能的影响. 结果表明，添加适量Nd(质量分数为0.06%)可以优化焊点界面组织，减缓时效过程中Sn-0.7Cu-0.05Ni/Cu界面化合物的生长速率，提高焊点力学性能，增强焊点的可靠性. 时效过程中，添加了0.06%Nd的Sn-0.7Cu-0.05Ni钎料焊点的剪切力始终保持最大，在时效1 440 h后，Sn-0.7Cu-0.05Ni-0.06Nd/Cu焊点的剪切力相比未添加稀土的Sn-0.7Cu-0.05Ni钎料提高了31.9%.
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| 关 键 词： | 稀土Nd Sn-Cu-Ni钎料 界面组织 力学性能 |
| 收稿时间： | 2019-09-28 |
Effect of Nd addition on microstructure and mechanical properties of Sn-0.7Cu-0.05Ni soldered joints |
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| LIU Shuang and XUE Songbai. Effect of Nd addition on microstructure and mechanical properties of Sn-0.7Cu-0.05Ni soldered joints[J]. Transactions of The China Welding Institution, 2020, 41(1): 50-54. DOI: 10.12073/j.hjxb.20190928002 |
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| Authors: | LIU Shuang and XUE Songbai |
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| Affiliation: | Nanjing University of Aeronautics and Astronautics, Nanjing, 210016, China |
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| Abstract: | The effects of Nd addition on the microstructure and mechanical properties of Sn-0.7Cu-0.05Ni/Cu soldered joints under as-reflowed and 150 °C isothermal-aging process were investigated. The results indicated that an appropriate amount of Nd addition could obviously improve the interfacial microstructure and the mechanical properties of Sn-0.7Cu-0.05Ni soldered joints. The optimum properties were obtained while Nd addition was 0.06wt. %. Besides, the growth of the Sn-Cu-Ni/Cu intermetallic compound layer under aging process was restrained by adding 0.06wt.% Nd, which would enhance the reliability of the soldered joints during service process. After aging for 1 440 h, the shear force of Sn-0.7Cu-0.05Ni-0.06Nd soldered joints still ranked the best among all of the tested solders, increased by 31.9% compared to the Nd-free Sn-Cu-Ni soldered joints. |
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| Keywords: | Nd Sn-Cu-Ni solders microstructure mechanical properties |
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