| 厚膜混合电路的激光调阻技术 |
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| 引用本文： | 李颖,林洪,陈琳,王雪冰,张娜,张治国.厚膜混合电路的激光调阻技术[J].仪表技术与传感器,2009(Z1). |
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| 作者姓名： | 李颖 林洪 陈琳 王雪冰 张娜 张治国 |
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| 作者单位： | 沈阳仪表科学研究院,辽宁沈阳,110043 |
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| 摘 要： | 文中重点论述了厚膜混合电路的激光调阻机理、激光调阻系统的结构、调阻工艺及参数、调阻工作程序、切割类型、切槽缺陷分析及合格切槽要求等方面的内容,对厚膜混合电路的激光调阻具有重要的指导意义.
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| 关 键 词： | 激光调阻系统 调阻工艺 工作程序 切槽 |
The Laser Trimming Technology of Thick Film Hybrid Integration Circuit |
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| LI Ying,LIN Hong,CHEN Lin,WANG Xue-bing,ZHANG Na,ZHANG Zhi-guo.The Laser Trimming Technology of Thick Film Hybrid Integration Circuit[J].Instrument Technique and Sensor,2009(Z1). |
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| Authors: | LI Ying LIN Hong CHEN Lin WANG Xue-bing ZHANG Na ZHANG Zhi-guo |
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| Abstract: | Laser trimming mechanism of thick film hybrid integration circuit was introduced.Trimming system structure,technological parameters,working program,etching types,etching notch defect analysis and the request for qualified etching notch were also discussd.It is significative to thick film hybrid circuit laser trimming resistor. |
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| Keywords: | laser trimming system trimming technology working program etching notch |
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