光纤端面研磨加工机理研究

给出了研磨光纤时的材料去除机理,选用粒度为微米及亚微米级的金刚石磨料砂纸,在研磨压力为0.48Mpa时,在KE-OFP-12型光纤连接器研磨机上对光纤端面进行了研磨实验.结果表明:光纤研磨加工的材料去除存在脆性断裂、半脆性半延性、延性等3种模式.材料去除模式主要取决于磨料的平均粒度,磨料粒度为3μm时,为脆性断裂到延性研磨的临界转换点.并从理论上对结果进行了分析,光纤以延性模式研磨加工时,光纤表面粗糙度Ra可达到纳米级,其表面看不到任何划痕,而光纤以脆性断裂模式研磨加工时,其表面粗糙度只能达到亚微米级,证明材料以延性模式去除是提高光纤表面质量的有效方法.

Mechanism research on lapping of optical fiber end-face

The material removal mechanism in optical fiber lapping is presented. With diamond lapping-film whose abrasive grain size is from micron to sub-micron, when the nominal lapping pressure was 0.48 MPa, the optical fiber end-face lapping experiment was conducted on optical fiber connector lapping machine of KE-OFP-12. The experiment results show that there are three material removal modes during lapping optical fiber,i.e. brittle fracture mode, semi-brittle and semi-ductile mode, and ductile mode. These modes are mainly controlled by abrasive grain size; there appears brittle-ductile transition's critical point when the lapping-films whose abrasive grain size is 3 μm is used to lap optical fiber. And these material modes are analyzed theoretically. The surface roughness can reach nanometer grade and there are not any scratches and cracks on the fiber end-face when fiber material is removed by ductile mode; and only sub-micron grade surface roughness can be gotten when fiber material is removed by brittle fracture mode. It proves that the ductile lapping mode is an effective method that improves surface quality of fiber end-face.