石墨烯–铝复合冷板散热性能试验研究

传统散热冷板以铝合金为主，其导热能力有限且本身密度较大，已无法满足嵌入式计算机对高效散热及轻量化的需求。针对该问题，文中提出将具有超高导热性能的石墨烯散热片粘贴在铝合金表面得到石墨烯–铝复合冷板，以石墨烯–铝复合冷板代替传统散热材料的方法，并对不同厚度、不同功耗下的石墨烯–铝复合冷板的导热效果进行了试验研究。测试结果表明，在铝合金表面贴石墨烯散热片可保证在整体质量增加较小的情况下显著提高冷板的导热能力，在3 mm厚的铝合金表面粘接2 mm厚的石墨烯散热片时导热性能最佳，导热系数达到360 ~ 370 W/(m·K)，而质量仅占6 mm厚铝板质量的66.5%。因此石墨烯–铝复合冷板可应用于高性能、高集成、小型化嵌入式计算机的散热设计。

Experimental Research on Heat Dissipation Performance of Graphene-aluminum Composite Cold Plate

As the traditional heat dissipation material, due to the limited thermal conductivity and large destiny, aluminum alloy can no longer meet the requirement of embedded computers for efficient heat dissipation and lightweight. It is put forward in this paper that the traditional cold plate is replaced with the graphenealuminum composite cold plate formed by sticking graphene films with ultra-high thermal conductivity to aluminum alloy. Experimental research on the heat dissipation performance of graphene films with different thickness under different power consumption is carried out. The test results show that graphene films can evidently improve the thermal conductivity of aluminum alloy in case of slight increase of weight. The thermal conductivity of 3 mm thickness aluminum alloy stuck to by 2 mm thickness graphene films reaches the maximum of 360~ 370 W/(m·K) while its weight is only 66.5% of 6 mm thickness aluminum alloy. Therefore, the graphene-aluminum composite cold plate can be applied to thermal design of embedded computers with high performance, high integration and miniaturization.