一种低温加热电路及其性能测试

机载电子设备呈现出高性能、高可靠、低成本的发展趋势,而采用工业档器件进行低温加热以满足机载环境条件的要求是降低电子设备成本的一个关键途径。为了深入探讨低温加热技术在机载环境条件下的应用,文中对比了几种不同的低温加热方式。针对适合机载环境条件的电阻加热方式研制了一套低温加热智能控制电路,详细介绍了该电路的工作原理和组成部分。并在此基础上搭建了一套试验测试系统,对低温加热性能进行了试验测试,确定了低温加热时间和加热功耗的关系。结果表明:当加热功率为27 W和19 W时,元器件表面温度从-55℃加热到-35℃的加热时间分别不超过2 min和5 min,符合GJB对元器件启动温度的要求。

A Low-temperature Heating Circuit and Its Performance Test

The airborne electronic equipment has the development tendency of high performance,high reliability and low cost,and the low-temperature heating of industrial components is the key to reduce the cost.Different kinds of low-temperature heating modes are compared in this paper in order to discuss the application of the low-temperature heating technique under airborne conditions.A low-temperature heating circuit aiming at the resistance heating is designed.The operation principle and composition of this circuit is introduced in detail.A test system is established on this basis and the low-temperature heating performance is tested.The relationship between time and power of low-temperature heating is determined.The test results show that when the heating power is 27 W and 19 W,the heating time from-55 ℃ to-35 ℃ is less than 2 minutes and 5 minutes respectively,which satisfies the GJB standard.