微喷印原电池置换成型织物基柔性导电线路的影响因素研究

针对目前智能纺织品中柔性导电线路制备工艺复杂、成本高、与纺织品融合度低等问题,提出了微喷印原电池置换成型织物基导电线路的制备方法。利用搭建的压电式微滴喷射系统,对沉积过程中硝酸银和抗坏血酸反应物浓度、反应物质量及原电池阳极基板的选择对成型导线微观形貌及方阻的影响进行研究。结果表明:在稳定喷射条件下,通过微喷印原电池置换沉积法可制备织物基导电线路;当硝酸银溶液、抗坏血酸溶液质量浓度分别为0.5 g/mL和0.3 g/mL、硝酸银打印层数为4层、织物与抗坏血酸溶液质量比为1∶2时,成型银导线方阻为 0.047 8 Ω/□, 标准偏差为0.009 138 Ω/□;当基板为铜时,在织物基底表面形成了均匀且致密的银层,银颗粒粒径较大,此时测得银导线方阻均值及标准偏差较小。

Influencing factors on flexible fabric-based electrical circuit formation by micro-jet printed primary cell replacement deposition

In view of the problems of complicated process, high cost, poor integration with textiles existing in the preparation of flexible electrical circuits in smart textiles, a method of micro-jet printing primary cell replacing deposit fabric-based electrical circuits is proposed. Based on the use of the piezoelectric micro-droplet ejection system, the effects of the concentration and mass of silver nitrate and ascorbic acid and the selection of anode substrate on morphology and square resistance for the formed circuits were studied. The results show that under stable ejection conditions, the fabric-based electrical circuits can be prepared using the proposed method. When the mass concentration of silver nitrate solution is 0.5 g/mL and that of ascorbic acid is 0.3 g/mL, the number of silver nitrate printing layers is 4, and the mass ratio of fabric to ascorbic acid solution is 1∶2, the obtained square resistance and standard deviation of the formed silver circuits are 0.047 8 Ω/□ and 0.009 138 Ω/□, respectively. When copper was applied for the base board, the silver layers on the surface of fabric substrate are uniform and dense with large silver particle size, and the average square resistance and variance of the obtained silver circuits became smaller.