无花果脆片膨化工艺中试研究

针对无花果鲜果不耐贮运、干燥深加工工艺欠缺的问题,利用变温压差膨化技术探讨无花果脆片加工工艺,利用正交试验加以感官评价,分析影响无花果脆片加工的重要技术参数。结果表明:无花果脆片最佳工艺参数为膨化温度85℃,膨化压力0.2 MPa,膨化次数3次,抽空温度85℃,抽空时间4.5 h,该条件下的无花果脆片具有良好的感官评价品质,感官评分可达86.61分,其中抽空温度对脆片感官评分影响最大。变温压差膨化的产品色泽变化较小,脆性更高,酥性降低,口感好,为今后无花果的脆片加工技术提供了理论参考依据。

Pilot Study on Fig Crisp Chips Puffing Process

In view of the problem that the fresh fig fruit is not resistant to storage and transportation,and the dry deep processing technology is lacking,the processing technology of fig crisp chips was studied by explosion puffing drying at modified temperature and pressure. The orthogonal test was used to evaluate by sensory evaluation,and the important technical parameters affecting the processing of fig crisp chips were analyzed. The results showed that the optimum parameters of fig crisp chips were as follows:puffing temperature 85℃,puffing pressure 0.2 MPa,puffing 3 times,evacuation temperature 85℃,evacuation time 4.5 h. The fig crisp chips under this condition had good sensory evaluation quality,the sensory score was up to 86.61 points. Evacuqtion temperature had the greatest effect on the sensory score of the crisp chips. The pressure difference puffed products had less color change,higher brittleness,lower crispness and good taste,which provided a theoretical reference for the crisp chips processing technology of fig in the future.