Temperature in thermally nonlinear pad–disk brake system |
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| Affiliation: | 1. School of Optical–electrical and Computer Engineering, University of Shanghai for Science and Technology, Shanghai 200093, China;2. School of Management, University of Shanghai for Science and Technology, Shanghai, China;3. Sino-British College, University of Shanghai for Science and Technology, Shanghai, China;4. Shanghai Key Lab of Modern Optical System, Shanghai, China;5. Engineering Research Center of Optical Instrument and System, Ministry of Education, Shanghai, China;1. Faculty of Science and Technology, Gunma University, Kiryu 376-8515, Japan;2. Graduate School of Engineering, University of Fukui, Fukui 910-8507, Japan;3. Institute of Industrial Science, The University of Tokyo, Tokyo 153-8505, Japan;1. Department of Mathematics, Quaid-I-Azam University, Islamabad 44000, Pakistan;2. Nonlinear Analysis and Applied Mathematics (NAAM) Research Group, Department of Mathematics, Faculty of Science, King Abdulaziz University, Jeddah 21589, Saudi Arabia;1. Department of Mathematics, University of Dhaka, Bangladesh;2. Department of Mechanical Engineering, Cleveland State University, USA |
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| Abstract: | The influence of the thermal sensitivity of pad and disk materials on temperature at braking is under investigation. A mathematical model of process of frictional heating in a pad–disk brake system, which takes into account the temperature-sensitive materials, is proposed. The basic element of this model is the thermal problem of friction—a one-dimensional boundary-value heat conduction problem with temperature-dependent thermal conductivity and specific heat. Contrary to the prior studies of authors, where a simple nonlinearity was considered, in this article the arbitrary nonlinearity of the thermophysical properties of materials is studied. The solution of a nonlinear boundary-value heat conduction problem is obtained by the method of successive approximations. The numerical analysis of temperature is executed for some materials of a pad and a disk with and without taking into account their thermal sensitivity. |
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