An application of thermal microscopes to the measurement of thermal effusivity of films |
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| Authors: | Kimihito Hatori Kei Suzuki Hiroyuki Fukuyama Hiromichi Ohta |
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| Affiliation: | 1. Hudson Lab., Bethel Co., Japan;2. Faculty of Engineering, Ibaraki University, Japan;3. Institute of Multidisciplinary Research for Advanced Materials (IMRAM), Tohoku University, Japan |
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| Abstract: | The application of thermal microscopes to the measurement of local thermal properties has drawn considerable scientific interest. We report on the application of a thermal microscope to the measurement of thermal effusivity for films comprising alumina deposited on a substrate, which were fabricated by an electrophoretic deposition method. The measured data was analyzed to consider the undulations on the sample surface The thermal effusivity of these samples was approximately 1×103 Js?0.5m?2K?1; this value is smaller than that for dense alumina because the alumina grain makes contact with a point. © 2008 Wiley Periodicals, Inc. Heat Trans Asian Res; Published online in Wiley InterScience ( www.interscience.wiley.com ). DOI 10.1002/htj.20227 |
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| Keywords: | thermal microscope thermal effusivity thin film undulation |
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