| 基于非硅微制造工艺的爆炸箔起爆器研究 |
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| 引用本文： | 李可为,褚恩义,薛艳,解瑞珍,任小明,任西,刘兰,刘卫.基于非硅微制造工艺的爆炸箔起爆器研究[J].兵工学报,2017,38(2):261-266. |
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| 作者姓名： | 李可为 褚恩义 薛艳 解瑞珍 任小明 任西 刘兰 刘卫 |
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| 作者单位： | (陕西应用物理化学研究所 应用物理化学国家级重点实验室, 陕西 西安 710061) |
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| 摘 要： | 为了实现爆炸箔起爆器的集成化和批量化制备，研究了爆炸箔起爆器非硅微制造工艺技术。采用磁控溅射和光刻技术制备了桥箔，通过紫外厚胶技术在桥箔上制备了聚甲基丙烯酸甲酯光刻胶飞片层，并利用SU-8光刻胶集成制造了加速膛，划片后一个衬底上制备了268个爆炸箔起爆器组件，每个组件的体积为0.018 cm3. 集成后的爆炸箔起爆器50%发火感度为2 185 V. 试验了爆炸箔起爆器组件的耐高温性能，结果表明在160 ℃下经历50 h以后，爆炸箔起爆器组件依然可以正常起爆Ⅳ型六硝基菧炸药柱。
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| 关 键 词： | 兵器科学与技术 爆炸箔起爆器 非硅微制造工艺 磁控溅射 |
| 收稿时间： | 2016-07-21 |
Research on Exploding Foil Initiator Based on Non-silicon MEMS Technology |
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| LI Ke-wei,CHU En-yi,XUE Yan,XIE Rui-zhen,REN Xiao-ming,REN Xi,LIU Lan,LIU Wei.Research on Exploding Foil Initiator Based on Non-silicon MEMS Technology[J].Acta Armamentarii,2017,38(2):261-266. |
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| Authors: | LI Ke-wei CHU En-yi XUE Yan XIE Rui-zhen REN Xiao-ming REN Xi LIU Lan LIU Wei |
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| Affiliation: | (National Key Laboratory of Applied Physics and Chemistry， Shaanxi Applied Physics and Chemistry Research Institute， Xi'an 710061， Shaanxi， China） |
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| Abstract: | The non-silicon MEMS manufacturing technology of exploding foil initiator (EFI) is studied to realize the integration and large-scale manufacture of EFI.The integrated bridge foils are fabricated by magnetron sputtering and lithography technology.The PMMA photoresist flyer layer is fabricated on the bridge foil by UV thick photoresist lithography process.SU-8 photoresist is used to fabricate the acceleration chamber.268 EFI chips are prepared on a wafer substrate with 0.018 cm3 for each chip.50％ ignition sensitivity of the integrated EFI is 2 185 V.The high temperature resistance of EFI chip is tested at 160 ℃ for 50 h.The results show that the EFI chips could reliably detonate HNS-Ⅳ. |
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| Keywords: | ordnance science and technology exploding foil initiator non-silicon MEMS magnetron sputtering |
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