| 新型可焊性锡铈铋镀层电镀工艺 |
| |
| 引用本文： | 倪光明,严怡芹.新型可焊性锡铈铋镀层电镀工艺[J].表面技术,1994,23(1):34-36. |
| |
| 作者姓名： | 倪光明 严怡芹 |
| |
| 作者单位： | 安徽师范大学化学系
(倪光明，严怡芹，张武)，安徽师范大学化学系(钟明宏) |
| |
| 摘 要： | 介绍了新型可焊性锡铈铋镀层电镀工艺的镀液配方和电镀操作条件;测试了镀液的分散能力、阴极电流效率和沉积速率.用铜丝或铜片作镀件,在小槽内电镀,获得的镀层,外观致密均匀,似镜面光亮,结合力强.
|
| 关 键 词： | 可焊性 锡铈铋合金 镀合金 |
A New Plating Process of Weldable Sn-Ce-Bi Film |
| |
| Ni Guangming & Yan Yiqin.A New Plating Process of Weldable Sn-Ce-Bi Film[J].Surface Technology,1994,23(1):34-36. |
| |
| Authors: | Ni Guangming & Yan Yiqin |
| |
| Abstract: | The bath formuler and the technological conditions of new weldable Sn-Ce-Bi plating are introduced. The dispersive capasity, the cathode current effeciency and the deposition rate are tested. A mirror glossy film on the copper wire or steel sheet is obtained. The uniform and compact film has strong binding force. |
| |
| Keywords: | weldable plating Sn-Ce-Bi alloy |
| 本文献已被 CNKI 维普 等数据库收录！ |
|
