表面形貌对TB8钛合金/环氧树脂粘结性能的影响

目的 通过在基体表面构建出不同的微观结构，提升环氧树脂与钛合金的粘结强度。方法 采用等离子刻蚀设备，调节气体流量、处理时间、RF功率对TB8钛合金样品进行处理，并对处理过的样品进行单搭接接头制备。利用扫描电子显微镜对等离子刻蚀前后的样品表面形貌进行研究，利用XPS分析刻蚀前后样品表面化学成分变化，利用水接触角表征样品表面润湿性，利用电子万能试验机对等离子刻蚀处理后的样品与环氧树脂的粘结强度进行研究。结果 采用CF4对样品进行等离子化学刻蚀，不同的刻蚀时间形成了不同类型的表面微观结构，其中圆粒状结构比蜂窝坑结构表面的粘结性能优越。采用Ar对样品进行等离子溅射刻蚀，样品表面形成纳米级片状微坑结构。等离子刻蚀后，基体表面更加洁净，活性增强，水接触角基本降为0°，润湿性显著提升。等离子刻蚀处理前，样品与环氧树脂的粘结强度为5.32MPa；等离子刻蚀处理后，样品与环氧树脂的粘结强度可达23.25 MPa，而经喷砂后，等离子刻蚀处理的样品与环氧树脂的粘结强度高达30.29 MPa。最佳等离子刻蚀处理工艺参数为RF功率540 W，气体流量120 mL/min，处理时间50 min，喷砂后最佳等离子刻...

Effects of Surface Morphology on Adhesive Bonding Properties of TB8 Titanium Alloy/Epoxy Resin

The work aims to improve the bonding strength between the epoxy resin and the titanium alloy by constructing different microstructures on the substrate surface. The plasma etching equipment was used to treat the TB8 titanium alloy samples by adjusting the gas flow rate, treatment time and RF power, and single-lap joints were prepared for the treated samples. The surface morphology of samples before and after plasma etching was studied by the scanning electron microscopy (SEM), the chemical composition changes of the sample surface before and after etching was analyzed by XPS, the wettability of the sample surface was characterized by the water contact angle, and the plasma etching treatment was carried out by electronic universal testing machine. The bond strength between the plasma-etched samples and epoxy resin was studied by electronic universal testing machine. When the samples were etched by CF4 plasma chemical etching, different types of surface microstructure were formed on the substrate surface at different etching time. The spherical granular structure had better surface bonding performance than the honey comb structure. When the samples were etched by plasma sputtering with Ar, nanoscale micro-pit structure was formed on the surface of the samples. The surface of titanium alloy was cleaner and its activity was enhanced after plasma etching. After plasma etching, the water contact angle was reduced to 0°, which indicated the wettability was improved significantly. Before plasma etching, the bonding strength between the samples and epoxy resin was 5.32 MPa; after plasma etching, the bond strength between the samples and epoxy resin was 23.25 MPa; and after sand blasting and plasma etching, the bond strength between the samples and epoxy resin was up to 30.29 MPa. The optimal plasma etching processing parameters were RF power 540 W, gas flow 120 mL/min, and treating time 50 min respectively. The optimal parameters of plasma etching after sandblasting are RF power 540 W, gas flow 120 mL/min and treatment time 40 min respectively. The Plasma etching treatment can significantly improve the adhesive bonding properties of TB8 titanium alloy, and the effect is better when combined with the sandblasting.