| Development of copper coatings on molybdenum powders by electroless plating technique |
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| 作者姓名： | 王光君 王德志 |
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| 作者单位： | Schools of Materials Science and Engineering, Central South University, Changsha 410083, China |
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| 基金项目： | Project （50301017） supported by the National Natural Science Foundation of China |
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| 摘 要： | Mo powders with average particle size of 3 μm were attempted to coat with copper by electroless plating technique. The effect of the solution composition and plating conditions on the electroless copper plating was studied. The uncoated and coated powders were subjected to the microstructural studies by SEM and the phases were analyzed by XRD. The results indicate that the Mo powders are coated with copper, at （he same time, Mo-Cu composite powders with Cu content ranging from 15% to 85% （mass fraction） can be obtained. The optimal values of pH, HCHO concentration and temperature are in the ranges of 12-13, 22-26 ml/L and 60-65℃, respectively. The diffusion-shrinkage autocatalytic model is suggested for the growth mechanism of electroless coating over the surface.
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| 关 键 词： | 化学镀铜 钼 铜 生长机制 |
| 收稿时间： | 2007-07-15 |
| 修稿时间： | 2007-09-10 |
Development of copper coatings on molybdenum powders by electroless plating technique |
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| WANG Guang-jun, WANG De-zhl.Development of copper coatings on molybdenum powders by electroless plating technique[J].Transactions of Nonferrous Metals Society of China,2007,17(A02):803-807. |
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| Authors: | WANG Guang-jun WANG De-zhl |
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| Abstract: | |
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| Keywords: | Mo-Cu electroless plating copper powders growth mechanism |
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