| 电沉积Cu/液体微胶囊复合镀层的微观结构及沉积机理 |
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| 引用本文： | 徐秀清,朱立群,李卫平,刘慧丛.电沉积Cu/液体微胶囊复合镀层的微观结构及沉积机理[J].中国有色金属学会会刊,2011(10):2210-2215. |
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| 作者姓名： | 徐秀清 朱立群 李卫平 刘慧丛 |
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| 作者单位： | 北京航空航天大学材料科学与工程学院; |
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| 基金项目： | Project(50771010) supported by the National Natural Science Foundation of China |
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| 摘 要： | 采用直流电沉积法制备纳米结构的Cu/液体微胶囊复合镀层。借助扫描电子显微镜（SEM）、透射电子显微镜（TEM）和X射线衍射（XRD）分析和表征复合镀层的表面形貌和微观结构。结果表明：加入微胶囊使得复合镀层由粗晶结构转变为纳米晶结构,其中镀层中液体微胶囊及铜纳米晶的尺寸分别为2～20μm和10～20nm。此外,通过理论分析证实了铜与液体微胶囊的电沉积过程遵循电化学沉积机理,并提出了相应的电沉积过程模型。
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| 关 键 词： | 铜/液体微胶囊复合镀层 直流电沉积 纳米结构 电沉积机理 |
Microstructure and deposition mechanism of electrodeposited Cu/liquid microcapsule composite |
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| XU Xiu-qing,ZHU Li-qun,LI Wei-ping,LIU Hui-cong School of Materials Science , Engineering,Beihang University,Beijing ,China.Microstructure and deposition mechanism of electrodeposited Cu/liquid microcapsule composite[J].Transactions of Nonferrous Metals Society of China,2011(10):2210-2215. |
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| Authors: | XU Xiu-qing ZHU Li-qun LI Wei-ping LIU Hui-cong School of Materials Science Engineering Beihang University Beijing China |
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| Affiliation: | XU Xiu-qing,ZHU Li-qun,LI Wei-ping,LIU Hui-cong School of Materials Science and Engineering,Beihang University,Beijing 100191,China |
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| Abstract: | The nanostructured copper/microcapsule containing liquid core materials composite(copper/liquid microcapsules composite) was prepared using direct current(DC) electrodeposition method.The surface morphology and microstructure of composite were investigated by means of scanning electron microscopy(SEM),transmission electron microscopy(TEM) and X-ray diffraction(XRD).The results show that the microstructure of electrodeposited layer transformed from bulk crystal to nano structure because of the participation ... |
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| Keywords: | copper/liquid microcapsule composite DC electrodeposition nanostructure electrodeposition mechanism |
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