| 化学镀铜及其应用 |
| |
| 引用本文： | 郑雅杰,邹伟红,易丹青,龚竹青,李新海.化学镀铜及其应用[J].材料导报,2005,19(9):76-78,82. |
| |
| 作者姓名： | 郑雅杰 邹伟红 易丹青 龚竹青 李新海 |
| |
| 作者单位： | 中南大学冶金科学与工程学院;中南大学材料科学与工程学院,长沙,410083 |
| |
| 基金项目： | 湖北大冶有色金属公司资助项目 |
| |
| 摘 要： | 综述了化学镀铜技术及其发展趋势,对化学镀铜的原理、工艺、镀液组成等方面进行了全面的分析,最后对化学镀铜今后的研究方向提出了一些见解.
|
| 关 键 词： | 化学镀铜 机理 工艺 应用 |
Technology and Application of Electroless Copper Plating |
| |
| Zheng Yajie,ZOU Weihong,Yi Danqing,Gong Zhuqing,li Xinhai.Technology and Application of Electroless Copper Plating[J].Materials Review,2005,19(9):76-78,82. |
| |
| Authors: | Zheng Yajie ZOU Weihong Yi Danqing Gong Zhuqing li Xinhai |
| |
| Affiliation: | 1 Metallurgical Science and Engineering College, Central South University; 2 Material Science and Engineering College, Central South University, Changsha 410083 |
| |
| Abstract: | The technology and development trend of electroless copper plating are summarized in this paper. The mechanism and the technics of electroless copper plating and the composition of solution are discussed in details. Some suggestions are made on electroless copper plating in the future. |
| |
| Keywords: | electroless copper plating mechanism technology application |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
|
