PZT厚膜的气雾化湿法减薄制备技术

锆钛酸铅（PZT）厚膜的制备技术是制作基于PZT厚膜的微传感器和微驱动器的关键技术之一．传统的制备方法难以兼顾厚膜制备中对厚度、性能、工艺复杂度以及成本等方面的要求，因此，提出了一种新的利用气雾化湿法减薄体材料制备PZT厚膜的技术．该技术结合传统的PZT湿法化学刻蚀方法和刻蚀雾滴的物理轰击效应，在反应中实时去除化学反应残留物，在减薄前后样品厚度均匀性几乎不变的情况下，平均刻蚀速率可达3．3μm/min，且工艺过程简单，成本低廉．实验结果表明，用该技术制备的PZT厚膜可满足微机电系统（MEMS）领域中微传感器和微致动器对于厚膜具备较高灵敏度和较大驱动能力的性能要求，

Spray Wet Etching Process for Preparing PZT Thick-Film

The fabrication of PZT thick-fill is one of the key technologies in the fabrication of PZT-based micro-sensors and micro-actuators. The traditional preparation methods cannot give attention to thick-fill thickness, performance, process complexity and cost requirements, so we proposed a novel technology using spray wet etching to prepare PZT thick-fill. The proposed technology, combining traditional PZT wet chemical etching with etchant droplets method of the physical effects, immediately removed the chemical residues, and when the thickness uniformity of samples was almost the same before and after etching, a high average etching rate reached 3.3 μm/min. Moreover, the process is simple and with low cost. Experimental results show that this spray wet etching technology of PZT thick-fill preparation is suitable for micro-sensors and micro-actuators with higher sensitivity and greater ability to drive the performance requirements in micro-electro-mechanical systems （MEMS） field.