基于SOI衬底加工的微型电场传感器研究

提出了一种基于微机械技术的微型电场传感器．该器件由振动部分和感应电极组成，通过静电梳齿结构驱动，并利用溅射到衬底的栅状金电极作为工作电极．基于SOI衬底加工的设计流程能够简化悬浮结构的制备．由于器件运动中受滑膜阻尼作用，因此可在大气下测试和封装，能够节约成本．阐述了器件的工作原理、结构仿真以及其键合／减薄工艺流程．该器件具有小尺寸和批量生产的优势，有望在安全预警和航天器升空环境探测等方面得以应用．

An Electric Field Microsensor Based on SOI Fabrication

This paper demonstrates a micromachined electric field sensor consisting of the vibratory frame and the induction electrodes. Comb-drive structure with electro static force is used for motion driving, and sputtered Au gratings serve as the working electrodes. Starting with the silicon on insulator (SOI) substrate, the fabrication design has an advantage in simplicity of suspension implementation . Due to the features of slide-film damping in vibration, such a device makes a tmospheric packaging a low-cost option for practical manufacture. This paper p resents its operating principles and the finite element simulation, as well as t he wafer-bond / thin-back process. The small-size and mass-production featur es will make it feasible in potential applications, such as security alert and s pacecraft launching.