| 可焊性锡基二元合金镀层研究的现状与展望 |
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| 引用本文： | 王爱荣,张焱,亓新华.可焊性锡基二元合金镀层研究的现状与展望[J].材料保护,2005,38(3):38-41,51. |
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| 作者姓名： | 王爱荣 张焱 亓新华 |
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| 作者单位： | 河南科技学院化工系,河南,新乡,453003 |
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| 摘 要： | 列举了12种不同镀液体系的典型配方及工艺.系统地概述了可焊性锡基二元合金电镀层、化学镀层工艺的应用状况,包括工艺条件、镀层性能、镀液特点等,并指出了每种工艺的镀液性能和镀层质量的优劣,对不同镀层的性能进行了分析.对可焊性锡基二元合金镀层的应用与发展作了展望.
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| 关 键 词： | 电镀 化学镀 锡基合金 可焊性 展望 |
| 文章编号： | 1001-1560(2005)03-0038-04 |
Review and Prospect of Solderable Tin-Based Binary Alloy Plating |
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| WANG Ai-rong,ZHANG Yan,QI Xin-hua.Review and Prospect of Solderable Tin-Based Binary Alloy Plating[J].Journal of Materials Protection,2005,38(3):38-41,51. |
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| Authors: | WANG Ai-rong ZHANG Yan QI Xin-hua |
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| Abstract: | A review is given on the state of the art and prospect of solderable Sn based binary alloy plating. The electroplating and electroless plating processes and formulations for the solderable tin alloy are summarized. And a prospect is presented for the development of the solderable Sn based alloy plating. It is pointed out that the solderable Sn based binary alloy plating has excellent solderability and corrosion resistance and would find wider application in electronics and surface finishing industries. |
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| Keywords: | Sn based alloy electroplating electroless plating solderability prospect |
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