| 三价铬硫酸盐体系快速电沉积可行性探讨 |
| |
| 引用本文： | 康振华,曾振欧,汪启桥,赵国鹏.三价铬硫酸盐体系快速电沉积可行性探讨[J].材料保护,2009,42(6). |
| |
| 作者姓名： | 康振华 曾振欧 汪启桥 赵国鹏 |
| |
| 作者单位： | 1. 华南理工大学化学与化工学院,广东,广州,510640
2. 广州二轻工业科学技术研究所,广东,广州,510663 |
| |
| 摘 要： | 三价铬镀铬是替代六价铬镀铬理想的清洁生产工艺.研究了电流密度、电镀时间和不同基体金属对三价铬硫酸盐镀液中快速镀铬的影响.结果表明:采用三价铬硫酸盐镀液在铜、镍和低碳铜基体上进行快速镀铬都可得到表面连续致密、结构为非晶态的铬镀层,镀速在铜基体上比在镍和低碳钢基体上快很多;电流密度10 A/dm2下电镀10 s,铜基体上可得到0.40μm以上的铬镀层,平均镀速可达2.50μm/min;镍和低碳钢基体上只能得到0.10μm的铬镀层,平均镀速为0.50 μm/min;快速镀铬的电流效率与电流密度有关,电流密度为10～12 A/dm2时可达25.0%以上;三价铬硫酸盐镀液长时间连续快速镀铬时镀液体积明显减少、pH值降低.
|
| 关 键 词： | 快速电沉积 硫酸盐 三价铬 镀铬 镀层厚度 镀速 可行性 |
Exploration of the Feasibility to Conduct High-Speed Chromium Electrodeposition in Trivalent Chromium Sulfate Solution |
| |
| KANG Zhen-hua,ZENG Zhen-ou,WANG Qi-qiao,ZHAO Guo-peng.Exploration of the Feasibility to Conduct High-Speed Chromium Electrodeposition in Trivalent Chromium Sulfate Solution[J].Journal of Materials Protection,2009,42(6). |
| |
| Authors: | KANG Zhen-hua ZENG Zhen-ou WANG Qi-qiao ZHAO Guo-peng |
| |
| Affiliation: | KANG Zhen-hua1,ZENG Zhen-ou1,WANG Qi-qiao1,ZHAO Guo-peng2(1.College of Chemistry , Chemical Engineering,South China University of Technology,Guangzhou 510640,Chi-na,2.Guangzhou Eating Plating Research Institute,Guangzhou 510663,China) |
| |
| Abstract: | With a view to the replacement of hexavalent chromium plating by trivalenl chromium plating as a clean technology,the effects of current density,plating time,and type of substrate materials on the plating rate of high-speed trivalent chromium electroplating in a sulfate bath were investigated.Results show that compact and amorphous Cr coating can be prepared on Cu,Ni,and mild car-bon steel substrates by high-speed trivalent chromium electropla-ting in sulfate bath,and the plating rate on copper is much high... |
| |
| Keywords: | high-speed electrodeposition sulfate trivalent chromium chromium plating thickness deposition velocity feasibility |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
|
