多晶硅表面金属催化化学腐蚀法制绒研究现状

在多晶硅太阳能电池的生产过程中, 金刚线切割技术(Diamond wire sawn, DWS)具有切割速度快、精度高、原材料损耗少等优点, 受到了广泛关注。金刚线切割多晶硅表面形成的损伤层较浅, 与传统的酸腐蚀制绒技术无法匹配, 金属催化化学腐蚀法应运而生。金属催化化学腐蚀法制绒具有操作简单、结构可控且易形成高深宽比的绒面等优点, 具有广阔的应用前景。本文总结了不同类型的金属催化剂在制绒过程中的腐蚀机理及其形成的绒面结构, 深入分析和讨论了具有代表性的银、铜的单一及复合催化腐蚀过程及绒面结构和电池片性能。最后对金刚线切割多晶硅片表面的金属催化化学腐蚀法存在的问题进行了分析, 并展望了未来的研究方向。

Texturing Technology on Multicrystalline Silicon Wafer by Metal-catalyzed Chemical Etching: a Review

In the production process of multicrystalline silicon solar cells, diamond wire sawn (DWS) cutting technology attracts wide attention because of its advantages of high cutting speed, high precision and less loss of raw materials. But the traditional acid etching technology cannot match the shallow damage layer formed on the surface of diamond wire sawn cut multicrystalline silicon wafer to make the texture surface. On the contrary, the metal-catalyzed chemical etching method owns the advantages of simple operation, controllable structure and easy to form the structure with high aspect ratio, indicating a wide range of application on diamond wire sawn cut multicrystalline silicon wafer. This paper systematically summarizes the work of the etching mechanisms and the structures of textures by different metal catalysts in the process of making texture surface, and deeply discusses the single and composite catalytic etching process of Ag and Cu, the structure of texture surface, and the performance of solar cells. Finally, the problems of metal-catalyzed chemical etching on the surface of diamond wire sawn cut multicrystalline silicon are analyzed, and their future research directions are prospected.