Si3N4陶瓷/Nb/Cu/Ni/Inconel 600界面反应层形成机制研究

观察分析了Si3N4陶瓷/Nb/Cu/Ni/Inconel600界面处反应层的形貌、元素分布、反应层中的相结构、界面反应以及反应层的生长规律,研究了Si3N4陶瓷/Nb/Cu/Ni/Inconel600界面处反应层的形成机制.研究结果表明:在连接过程中,Cu层首先熔化,Nb、Ni向液态Cu中扩散溶解形成Cu-Nb-Ni合金,液态合金中的Nb和Ni向Si3N4表面扩散聚集并与Si3N4反应形成反应层;Si3N4侧的反应层主要物相是NbN和Nb、Ni的硅化物,Ni基合金侧反应相主要是NbNi3和Cu-Ni合金;在连接温度为1403 K的条件下,随着连接时间的增加,界面反应层厚度先快速增加,再缓慢增加.

Study on the mechanism of reaction layer formation at the interface between Si3N4 ceramic and Nb/Cu/Ni/Inconel 600

Mechanism of interfacial reaction between Si_3N_4ceramic and Nb/Cu/Ni interlayer was studied in this paper.The microphotograph,element distribution and phase structure in reaction layer was investigated.Interfacial reaction was analyzed from the standpoint of thermodynamics and the change of reaction layer thickness was also observed and analyzed.The results showed that Nb and Ni dissolved into molten Cu to form Cu-Nb-Ni liquid alloy and then diffused to the surface of Si_3N_4 to form reaction layer.The reaction layer near Si_3N_4ceramic was rich in Si and N element,and the main products inside it were NbN and the silicide of Nb,Ni.The reaction layer at the side of Ni based alloy was rich in Cu,the main products in it were NbNi_3 and Cu-Ni alloy.When bonding temperature was 1403 K,reaction layer grew fast at first and then slow down with the increase of bonding time.