聚合物纳米石墨烯复合材料导热性能研究进展

集成电路伴随着电子、航天和航空领域的发展而快速发展,但往往伴随着散热困难的问题,影响着使用效率和仪器寿命。从质量、耐蚀性、加工工艺和成本等方面考虑,聚合物复合材料是导热材料中最具发展前景的材料。然而聚合物固有的导热率非常低,因此,提高聚合物的导热率对于其在这些领域的应用显得非常重要,这在过去的20年中已经成为一个非常重要的研究课题。主要从以下两个方面进行介绍:(1)从分子链形态、链结构和链间耦合3个方面分析总结了聚合物的微观导热机理;(2)重点介绍近年来石墨烯填充聚合物纳米复合材料导热性能的主要研究进展以及未来的研究挑战。

Progress in thermal conductivity of polymer nano-graphene nanocomposites

With the development of electronics , spaceflight and aviation , the integrated circuit develops rapidly , but it is often accompanied by the problem of heat dissipation , which affects the efficiency and the life of instru - ments.Considering the weight , corrosion resistance , processing technology and cost , polymer composites are the most promising materials for thermal conductivity.However , the inherent thermal conductivity of polymers is very low , so improving the thermal conductivity of polymers is very important for their applications in these fields , which has become a very important research topic in the past two decades.In this review paper , the fol - lowing two aspects were mainly introduced.The microthermal conductivity mechanism of polymers was ana - lyzed and summarized from three aspects of molecular chain morphology , chain structure and inter - chain cou - pling.The main research progress in the thermal conductivity of graphene - filled polymer nanocomposites in re - cent years and the research challenges in the future were highlighted.