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二层柔性覆铜板用聚酰亚胺研究进展
引用本文:杨培发,严辉,范和平.二层柔性覆铜板用聚酰亚胺研究进展[J].绝缘材料,2006,39(3):27-31,35.
作者姓名:杨培发  严辉  范和平
作者单位:湖北省化学研究院,湖北,武汉,430074
摘    要:简要介绍了二层柔性覆铜板的生产工艺、基体树脂配方及其性能特点,重点介绍了五类二层柔性覆铜板用的聚酰亚胺树脂即全芳香型、醚酮型、双酚(砜)A型、芳香酯型、混合型的聚酰亚胺树脂的研究进展,及其生产的二层柔性覆铜板的性能。

关 键 词:二层柔性覆铜板  聚酰亚胺  性能
文章编号:1009-9239(2006)03-0027-06
收稿时间:2005-12-23
修稿时间:2006-03-27

Advances in Polyimide Used in Two-layer Flexible Copper Clad Lamination
YANG Pei-fa,YAN Hui,FAN He-ping.Advances in Polyimide Used in Two-layer Flexible Copper Clad Lamination[J].Insulating Materials,2006,39(3):27-31,35.
Authors:YANG Pei-fa  YAN Hui  FAN He-ping
Abstract:This paper Briefly introduces the producing processes,resin compositions,its characteristics of two-layer flexible copper clad lamination(FCCL) used in flexible printed circuit board(FPC),and mainly introduces the advances and the performances of the polyimides which are used in two-layer FCCL and classified into five types of full-aromatic polyimide,ether-ketone polyimide,biphenol-(sulfone) polyimide,aromatic-ester polyimide and mixtures of aforesaid polyimide.
Keywords:two-layer FCCL  polyimide  performance
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