| 改善无胶型挠性覆铜板粘接性能的研究进展 |
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| 引用本文： | 庄永兵,顾宜.改善无胶型挠性覆铜板粘接性能的研究进展[J].绝缘材料,2012,45(1):25-29. |
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| 作者姓名： | 庄永兵 顾宜 |
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| 作者单位： | 1. 四川大学高分子科学与工程学院,高分子材料工程国家重点实验室,成都610065;湖南文理学院,湖南常德415000
2. 四川大学高分子科学与工程学院,高分子材料工程国家重点实验室,成都610065 |
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| 摘 要： | 从铜箔表面处理、聚酰亚胺薄膜表面处理与改性及其本体分子结构设计三方面综述了改善二层无胶型挠性覆铜板的研究进展,并对其进行了展望。
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| 关 键 词： | 无胶型挠性覆铜板 粘接性 聚酰亚胺 铜箔 |
Research Progress in Improving Adhesive Property of Two-layer Flexible Copper Clad Laminate |
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| Zhuang Yongbing
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Gu Yi.Research Progress in Improving Adhesive Property of Two-layer Flexible Copper Clad Laminate[J].Insulating Materials,2012,45(1):25-29. |
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| Authors: | Zhuang Yongbing Gu Yi |
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| Affiliation: | 1(1.College of Polymer Science and Engineering,Sichuan University,Chengdu 610065,China;2.Hunan University of Arts and Science,Changde 415000,China) |
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| Abstract: | The research progress in improving the adhesive property of two-layer free-adhesive flexible copper clad laminate(2L-FCCL) was reviewed from aspects of surface treatment of copper foil,surface treatment and modification of polyimide film and its ontology molecular structure design,and then the development direction was prospected. |
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| Keywords: | non-gel type of flexible copper clad laminate adhesive property polyimide copper foil |
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