首页 | 官方网站   微博 | 高级检索  
     

复合导电高分子材料微观网络结构及导电行为仿真分析
引用本文:徐晓英,王世安,王辉.复合导电高分子材料微观网络结构及导电行为仿真分析[J].高电压技术,2012,38(9):2221-2229.
作者姓名:徐晓英  王世安  王辉
作者单位:1. 武汉理工大学物理系,武汉,430070
2. 武汉文献情报中心,武汉,430070
基金项目:武器装备预研基金重点项目(9140A31030110JB3403)~~
摘    要:导电填料的形貌、尺寸、材料特性及导电填料之间、导电填料与基体之间的相互作用等因素,均能对复合导电高分子材料的导电行为产生重要的影响。为此,通过建立球状导电填料填充的复合导电高分子材料微观结构模型,利用Matlab计算软件,仿真分析了复合导电高分子材料的导电行为即渗流现象,研究了导电填料的粒径大小和体积分数对复合导电高分子材料导电特性的影响。研究结果表明,该仿真模型能够从整体上反映复合导电高分子材料的导电特性,并能推广到其他形貌的导电填料的情况以及三维领域。

关 键 词:复合导电高分子材料  微观  渗流理论  数值模型  导电行为  体积分数

Simulation Analysis on the Micro-network Structure and Conducting Behavior of Conductive Polymer Composites
XU Xiaoying,WANG Shi’an,WANG Hui.Simulation Analysis on the Micro-network Structure and Conducting Behavior of Conductive Polymer Composites[J].High Voltage Engineering,2012,38(9):2221-2229.
Authors:XU Xiaoying  WANG Shi’an  WANG Hui
Affiliation:1.Department of Physics,Wuhan University of Technology,Wuhan 430070,China; 2.Wuhan Documentation and Information Center,Wuhan 430070,China)
Abstract:The morphology,size,and material properties of composite conductive polymer conductive filler,along with the interaction among the conductive filler particles and the matrix,have important impacts on the filler’s conductive behavior.Establisheing a micro-structural model of the composite conductive polymer with spherical conductive fillers,we simulated and analyzed the conductive behavior of the composite conductive,mainly,the percolation phenomenon,by the Matlab software.Moreover,we studied the effect of conductive filler particle size and volume fraction of composite electrical properties of conductive polymer materials on the filler’s conductive behavior.It is concluded that the simulation model can reflect electrical properties of composite conducting polymer materials,and can be extended to other conductive filler morphologies or three-dimension.
Keywords:conductive polymer composites  microscopic  percolation theory  numerical model  conductive behavior  volume fraction
本文献已被 CNKI 万方数据 等数据库收录!
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司    京ICP备09084417号-23

京公网安备 11010802026262号