一种改进的降低IGBT模块管芯互连寄生电感方法

目前在IGBT模块封装工艺中广泛采用的管芯互连方法—铝丝互连技术存在着寄生电感大，开关瞬态电流分布不均匀，以及铝丝之间存在机械振动等问题。本文通过对互连铝丝寄生参数的分析，阐述了造成这些问题的关键原因，并且提出了一种改进的方法。这种改进方法能够降低铝丝之间的电磁耦合，从而降低互连的等效电感，减弱振动的影响。最后，计算、仿真和实验证明这种改进的方法是有效的。

A NOVEL CHIP INTERCONNECTON METHOD OF LOW PARASITIC INDUCTANCE IN IGBT MODULE

Wirebond technology is a kind of primary chip interconnection technology widely used in IGBT module packaging currently. But wirebond technology has some disadvantages, such as high parasitic inductance, unequal current distribution and wire vibration. This paper analyzes parasitic parameter issue of interconnection wire and explains main cause of the disadvantages. Then, this paper proposes a novel method to reduce parasitic inductance, improve current distribution and depress vibration effect. Analysis, simulation and experiment verify the effectiveness of this novel method.