粘弹性聚合物微压印过程的仿真

为了获得更好的微压印填充效果,采用有限元仿真的方法研究了模具和衬底的几何参数对微压印工艺的影响,建立了聚合物的粘弹性材料模型以及微压印的几何模型.仿真结果表明,在相同的压印时间、压印温度和压印力下,模具的占空比为0.5时,材料对模具腔体的填充率最高为60%,占空比升高或下降都会使得填充率有所下降;模具的深宽比越低模具腔体的填充率越高,模具的深宽比为1时,填充率最高为71%;衬底的深宽比越高填充率越大,衬底深宽比为1.5时,填充率最高为63%.

Simulation of Micro-embossing of Viscoelastic Polymer

In order to get better micro-embossing filling effect,the influence of the geometry paramenters of the mold and substrate on micro-embossing is examined by finite element simulation.A geometrical model of micro-embossing and the viscoelastic material model of playmer are established.The simulation result shows that with the same embossing time,temperature and pressure,and when the duty ration of the mold is 0.5,the highest filling rate of the mold＇s cavity is up to 60%,any rise or drop in the duty ratio will lower the filling rate.The lower the aspect ration,the higher the filling rate of the mold＇s cavity.When the aspect ratio is 1,the highest filling rate is 71%.The higher the substrate＇s aspect ration,the higher the filling rate.When the aspect ratio is 1.5,the highest filling rate is 63%.