| 系统级封装中穿透性硅通孔建模及分析 |
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| 引用本文： | 缪旻,梁磊,李振松,许淑芳,张月霞.系统级封装中穿透性硅通孔建模及分析[J].北京机械工业学院学报,2011(3):15-19. |
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| 作者姓名： | 缪旻 梁磊 李振松 许淑芳 张月霞 |
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| 作者单位： | 北京信息科技大学信息微系统研究所;北京大学微米/纳米加工技术国家级重点实验室; |
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| 基金项目： | 中国国家高技术研究发展计划项目(863计划,2007AA04Z352); 国家自然科学基金项目(60976083,60501007); 北京市自然科学基金项目(3102014); 北京邮电大学泛网无线通信教育部重点实验室项目(KFKT-2010101) |
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| 摘 要： | 针对系统级封装技术（SIP，system in package）详细分析了穿透性硅通孔（TSV，through silicon via）的半径、高度和绝缘层厚度等物理结构对于三维系统级封装传输性能的影响，提出了TSV吉赫兹带宽等效电路模型，并提取出其电阻、电容、电感等无源元件值，对于所提出的电路模型进行了时域分析，仿真给出了眼图。
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| 关 键 词： | 系统级封装 穿透性硅通孔 等效电路 参数提取 眼图 |
3D Modeling and analysis of through-silicon-vias in system in package |
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| MIAO Min,LIANG Lei,LI Zhen-song,XU Shu-fang,ZHANG Yue-xia.3D Modeling and analysis of through-silicon-vias in system in package[J].Journal of Beijing Institute of Machinery,2011(3):15-19. |
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| Authors: | MIAO Min LIANG Lei LI Zhen-song XU Shu-fang ZHANG Yue-xia |
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| Affiliation: | MIAO Min1,2,LIANG Lei1,LI Zhen-song1,XU Shu-fang1,ZHANG Yue-xia1(1.Institute of Information Microsystem,Beijing Information Science and Technology University,Beijing 100101,China,2.National Key Laboratory of Micro/Nano Fabrication Technology,Peking University,Beijing 100871,China) |
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| Abstract: | The impact of physical configurations such as through silicon via(TSV) radius,TSV height and thickness of SiO2 on the transmission performance of system in package(SIP) is explored.A gigahertz equivalent circuit model of TSV in 3D Integrated Circuits is proposed and the values of passive elements within the model are extracted from full-wave scattering parameters.The proposed circuit model is analyzed in time domain,and the eye-diagram is shown based on the proposed circuit model. |
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| Keywords: | system in package through silicon via equivalent circuit parameter extraction eye diagram |
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