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A strategy for fabricating textured silicon nitride with enhanced thermal conductivity
Affiliation:1. Yokohama Oils & Fats Industry Co., Ltd., 1-1 Minamisengencho, Nishi-ku, Yokohama 220-0074, Japan;2. Materials Processing Unit, National Institute for Materials Science, 1-2-1 Sengen, Tsukuba, Ibaraki 305-0047, Japan;3. Advanced Manufacturing Research Institute, National Institute of Advanced Industrial Science and Technology, 2266-98 Anagahora, Shimo-Shidami, Moriyama-ku, Nagoya 463-8560, Japan;4. Department of Materials and Life Sciences, Sophia University, Chiyoda Ku, Tokyo 1028554, Japan;1. State Key Laboratory of High Performance Ceramics and Superfine Microstructure, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 200050, China;2. Federal Institute for Materials Research and Testing, Unter den Eichen 44-46, 12203 Berlin, Germany;3. Institute of Nonmetallic Materials, Clausthal University of Technology, Zehntnerstr. 2a, Clausthal-Zellerfeld 38678, Germany;1. State Key Laboratory of High Performance Ceramics and Superfine Microstructure, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai, 200050, China;2. Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing, 100049, China;1. Key Laboratory for Anisotropy and Texture of Materials (Ministry of Education), Northeastern University, Shenyang, Liaoning 110819, China;2. Institute of Ceramics and Powder Metallurgy, School of Materials Science and Engineering, Northeastern University, Shenyang, Liaoning 110819, China
Abstract:C-axis textured Si3N4 with a high thermal conductivity of 176 W m−1 K−1 along the grain alignment direction was fabricated by slip casting raw α-Si3N4 powder seeded with near-equiaxed β-Si3N4 particles and Y2O3–MgSiN2 as sintering additives in a rotating strong magnetic field of 12 T, followed by gas pressure sintering at 1900 °C for 12 h at a nitrogen pressure of 1 MPa. The green material reached a relative density of 57%, with slip casting and the sintered material exhibited a relative density of 99% and a Lotgering orientation factor of 0.98. The morphology of the β-Si3N4 seeds had little effect on the texture development and thermal anisotropy of textured Si3N4. The technique developed provides highly conductive Si3N4 with conductivity to the thickness direction, which is a major advantage in practical use. The technique is also simple, inexpensive and effective for producing textured Si3N4 with high thermal conductivity of over 170 W m−1 K−1.
Keywords:Texture  Thermal conductivity  Sintering
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