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Thermal conductivities and mechanical properties of AlN ceramics fabricated by three dimensional printing
Affiliation:1. Key Laboratory of Space Manufacturing Technology (SMT), Chinese Academy of Sciences, Beijing, 100094, PR China;2. Technology and Engineering Centre for Space Utilisation, Chinese Academy of Sciences, Beijing, 100094, PR China;3. Department of Ceramic and Metal to Ceramic Sealing, Beijing VacuumElectronics Research Institute, Beijing, 100016, PR China;1. Department of Physics, The University of Texas at El Paso, El Paso, TX, 79968, USA;2. W. M. Keck Center for 3D Innovation, The University of Texas at El Paso, El Paso, TX, 79968, USA;3. College of Science and Mathematics, School of Health Professions, Rowan University, Glassboro, NJ, 08028, USA;4. Department of Mechanical Engineering, The University of Texas at El Paso, El Paso, TX, 79968, USA;1. School of Physics and Nuclear Energy Engineering, Beihang University, Beijing 100191, PR China;2. Department of Ceramic and Metal to Ceramic Sealing, Beijing Vacuum Electronics Research Institute, Beijing 100016, PR China;3. CMC Laboratories, Inc. Tempe, AZ 85284, USA;4. State Key Laboratory of New Ceramics & Fine Processing, School of Materials Science and Engineering, Tsinghua University, Beijing 100084, PR China;1. W. M. Keck Center for 3D Innovation, College of Engineering E-108, University of Texas at El Paso, University Ave. 500 W, El Paso, TX, 79968, USA;2. Department of Mechanical Engineering, The University of Texas at El Paso, El Paso, TX, 79968, USA;3. Centro de Investigación en Materiales Avanzados S.C., Miguel de Cervantes #120, Complejo Industrial Chihuahua, Chihuahua, C.P., 31109, Mexico
Abstract:AlN ceramics were successfully fabricated through a joint process of digital light processing (DLP) 3D printing technology and heat treatment at 1780 °C~1845 °C. DLP is an addictive manufacturing process, enabling the near net shape fabrication. The AlN grains in this work developed well and there were small amounts of grain-boundary phases at the three-grain junctions. The particle size of AlN became larger and the densification increased with increasing sintering temperature. The pores of AlN ceramics also decreased, which led to the increase of thermal conductivity and flexural strength. The optimal thermal conductivity and flexural strength of AlN ceramic reached 155 W/(m·K) and 265 ± 20 MPa when sintered at 1845 °C.
Keywords:Three dimensional printing (3DP)  Digital light processing (DLP)  AlN  Thermal conductivity  Mechanical properties
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