| 平行封焊工艺研究 |
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| 引用本文： | 李晓燕,冯哲.平行封焊工艺研究[J].电子工业专用设备,2006,35(12):47-49. |
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| 作者姓名： | 李晓燕 冯哲 |
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| 作者单位： | 中国电子科技集团公司第二研究所,山西,太原,030024 |
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| 摘 要： | 平行封焊是微电子器件封装过程中的最后一道工序,封焊质量的好坏对产品的合格率有很大的影响,为了提高焊接质量,进而提高平行封焊设备的性能,研究平行封焊工艺显得至关重要。
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| 关 键 词： | 平行封焊 工艺 检漏 |
| 文章编号： | 1004-4507(2006)12-0047-03 |
| 收稿时间： | 11 27 2006 12:00AM |
| 修稿时间： | 2006年11月27 |
The Research of Parallel Seam Sealing Technology |
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| LI Xiao-yan,FENG Zhe.The Research of Parallel Seam Sealing Technology[J].Equipment for Electronic Products Marufacturing,2006,35(12):47-49. |
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| Authors: | LI Xiao-yan FENG Zhe |
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| Affiliation: | The 2th Research Institute ofCETC, Taiyuan 030024, China |
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| Abstract: | The parallel seam sealing is a process of the last device packaging processes. The quality of welding has an effect on the pass rate of products. In order to enhance the quality of welding and to improve the performance of parallel seam equipments, the research of parallel seam sealing technology is particularly important. |
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| Keywords: | Parallel Seam Sealing process monitor |
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