面向可见光通信的硅基InGaN/GaN多量子阱波导定向耦合器光子集成芯片

利用可见光信号作为新型信息载体的光通信技术近些年来得到长足发展，为了开发新一代光子集成芯片作为可见光通信网络的终端器件，满足可见光信号发射、接收、传输与处理的复合需求，该文基于硅基InGaN/GaN多量子阱材料，设计了一种集成可见光波段微型发光二极管(LED)光源、波导定向耦合器、微型光电探测器于一体的光子集成芯片。该芯片利用InGaN/GaN多量子阱材料的发光探测共存现象，实现了上述复合功能。微型LED光源作为发射端，可以发射出蓝色波段的可见光信号，其发光强度受到注入电流的线性调制，可实现调幅可见光通信，适合作为可见光通信的发射端。微型LED光源发射的可见光信号传输进入波导定向耦合器，实现了片内有效传输耦合和光功率平均分配。经过耦合传输的可见光信号进入微型光电探测器，可以监测到与耦合传输的光信号强度相匹配的光电流。最后，可见光通信测试也表明该芯片可实现有效的可见光通信。该研究为发展面向可见光通信网络需求的复合功能光子集成芯片终端提供了更多可能性。

Silicon-based InGaN/GaN Multiple Quantum Well Waveguide Directional Coupler Photonic Integrated Chip for Visible Light Communication

Optical communication technology using visible optical signal as a new information carrier is greatly developed in recent years. In order to develop a new generation of photonic integrated chip as a terminal device of the visible optical communication network, to meet the composite requirements of the visible optical signal transmission,reception, transmission and processing. Based on the silicon-based InGaN/GaN multi-quantum well material, a composite photon integrated chip integrating visible band micro Light-Emitting Diode (LED) light source, waveguide directional coupler and micro photodetector is designed. A luminescence detection coexistence phenomenon of a InGaN/GaN multi-quantum well material is used in this chip to achieve the above composite function. As the transmitting end, the micro LED light source can emit the blue band visible light signal. Its luminous intensity is linear modulated by the injection current, which can realize the amplitude modulation visible light communication, which is suitable for the transmitting end of visible light communication. The visible light signal transmitted by the micro LED light source is transmitted into the waveguide directional coupler, which realizes the effective in-chip transmission coupling and the average optical power distribution of the chip. After the visible light signal passed through the coupled transmission enters the microphotodetector, a photocurrent matching the intensity of the coupled transmitted light signal can be monitored. Finally, effective visible light communication of this chip is also confirmed by visible light communication testing. It provides more possibilities for developing composite functional photon integrated chip terminals facing the needs of visible optical communication networks through this reserach.