首页 | 官方网站   微博 | 高级检索  
     


A Dynamically Hybrid Crosslinked Elastomer for Room-Temperature Recyclable Flexible Electronic Devices
Authors:Yifan Guo  Lei Yang  Luzhi Zhang  Shuo Chen  Lijie Sun  Shijia Gu  Zhengwei You
Affiliation:State Key Laboratory for Modification of Chemical Fibers and Polymer Materials, International Joint Laboratory for Advanced Fiber and Low-dimension Materials, Shanghai Engineering Research Center of Nano-Biomaterials and Regenerative Medicine, College of Materials Science and Engineering, Institute of Functional Materials, Donghua UniversityShanghai, 201620 China
Abstract:The rapid development of flexible electronics has resulted in serious pollution in the form of electronic waste. Accordingly, recyclability is highly desirable for these devices, but this remains a significant challenge. A dynamically hybrid crosslinked polyurethane (FPU) elastomer is designed in this study to address this challenge. Distinctive Diels–Alder adducts with suitable dissociation and reassociation dynamics are designed as crosslinking units to provide an efficient time frame for recycling. FPU is maintained in a state with a low crosslinking density after heating at 120 °C for 5 min. FPU-based electronics can therefore be dissolved in chloroform under ambient conditions to separate the electronic components and polymers for the refabrication of new electronic devices. This is the first reported thermoset elastomer that can be completely recycled at room temperature without chemical treatment to decompose the polymer chain. The design concept is applied by demonstrating the fabrication by recycling of different FPU-based flexible electronic devices: position sensor, flexible keyboard, and motion sensor. Furthermore, the FPU has many advantages as a material for flexible electronics in terms of its biomimetic mechanical properties, room-temperature self-healing, and facile processability. This study provides promising new design principles to develop materials for promoting sustainable flexible electronics.
Keywords:dynamic bonds  flexible electronics  sustainability  thermoset
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司    京ICP备09084417号-23

京公网安备 11010802026262号