| 倒装再分布技术及应用 |
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| 引用本文： | 任春岭,高娜燕,丁荣峥.倒装再分布技术及应用[J].电子与封装,2009,9(12):1-4,10. |
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| 作者姓名： | 任春岭 高娜燕 丁荣峥 |
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| 作者单位： | 无锡中微高科电子有限公司,江苏,无锡,214035 |
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| 摘 要： | 随着半导体技术的发展，封装工艺与圆片工艺的联系越来越密切，特别是倒装技术的发展及广泛应用。由CSP到WL-CSP，再到TSV技术，封装技术的发展越来越迅速。倒装技术是发展的关键技术，它包括再分布技术、凸点底层金属（UBM）技术、凸点制备技术、倒扣焊接技术和底部填充技术等。文章介绍了传统芯片通过再分布设计及工艺解决实现倒装工艺，为倒装技术以及新技术的开发和应用提供了良好的途径和广阔的空间。
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| 关 键 词： | 倒装芯片 再分布技术 UBM 凸点制备技术 底部填充 |
Redistribution Technology of Flip Chip and Its Application |
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| REN Chun-ling,GAO Na-yan,DING Rong-zheng.Redistribution Technology of Flip Chip and Its Application[J].Electronics & Packaging,2009,9(12):1-4,10. |
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| Authors: | REN Chun-ling GAO Na-yan DING Rong-zheng |
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| Affiliation: | REN Chun-ling,GAO Na-yan,DING Rong-zheng (Wuxi Zhongwei High-tech Electronics Co.,Ltd.,Wuxi 214035,China) |
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| Abstract: | With the development of Flip chip technology, the relation of packaging technology and wafer technology are so close. Especially Flip chip technology has been developed and widely applied. From CSP to WL-CSP, until TSV technology, the development of Electrical packaging technology is so rapid. The key tech-nologies of Flip chip technology are that redistribution technology, under bump metallurgy(UBM), bump technology, reflow technology and underfill technology. In this paper, redistribution technology is di... |
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| Keywords: | UBM |
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