基板型模块的直压模塑和注塑模塑分析

模塑是半导体封装中十分重要的工艺,不同结构特性的基板型模块对模塑工艺要求也不同。分析了基板型模块直压模塑和注塑模塑的特性及效果,包括模塑外观、翘曲、金丝冲丝以及模塑料的填充性,并对比分析不同复杂度结构的基板型模块模塑料的填充效果,发现直压模塑和注塑模塑各有优劣。直压模塑工艺的模塑料不流动特性使其在填充流动小的封装中具有明显的优势。明确了两种模塑技术的不同适用性,为不同应用中选择合适的模塑工艺方案提供指导。

Study of Compression Mold and Transfer Moldon Substrate Module

Molding is very important process in semiconductor package,the different package structure requires different mold technologies.Characteristics and effects of compression mold and transfer mold,including the mold thickness,warpage,wire sweep and compound fill ability base on mold features,especially on the fill effect for some complicated structure package are studied.The advantage and shortage both in compression mold and transfer mold are found out.Compression mold has significant advantage on mold fill without compound flow.The characteristics of two mold technologies are specified,which helps to choose the proper mold solution for different applications.