| 三维多芯片组件的散热分析 |
| |
| 引用本文： | 蒋长顺,谢扩军,许海峰,朱琳.三维多芯片组件的散热分析[J].电子与封装,2005,5(11):21-25. |
| |
| 作者姓名： | 蒋长顺 谢扩军 许海峰 朱琳 |
| |
| 作者单位： | 电子科技大学物理电子学院,四川,成都,610054 |
| |
| 摘 要： | 建立了一种叠层多芯片组件结构，应用计算流体动力学方法(CFD)，对金刚石基板的三维多芯片结构进行了散热分析，模拟了器件在强制空气冷却条件下的热传递过程和温度分布。此外，还探讨了各种设计参数和物性参数对3D-MCM器件温度场的影响。
|
| 关 键 词： | 计算流体动力学 3D-MCM |
| 文章编号： | 1681-1070（2005）11-21-05 |
| 收稿时间： | 2005-10-10 |
| 修稿时间： | 2005年10月10 |
An Investigation into Heat Dissipation Analysis of the 3D_MCM |
| |
| Jiang Chang-shun,Xie Kuo-jun,Xu Hai-feng,Zhu Lin.An Investigation into Heat Dissipation Analysis of the 3D_MCM[J].Electronics & Packaging,2005,5(11):21-25. |
| |
| Authors: | Jiang Chang-shun Xie Kuo-jun Xu Hai-feng Zhu Lin |
| |
| Affiliation: | University of Electronic Science and Technology of China, Sichuan Chengdu 610054, China |
| |
| Abstract: | A stacked MCM model was developed, computational fluid dynamics solution was utilized to proceed the thermal dissipation analysis of the stacked MCM with CVD-diamond substrates, to simulate the heat transfer process and the temperature distribution of the MCM under forced air-cooling conditions, and the effects of different factors on the 3D-MCM temperature distribution are investigated, the affecting parameters include thermophysical properties and design structural properties. |
| |
| Keywords: | 3D-MCM |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
|
