| 铜丝球键合工艺及可靠性机理 |
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| 引用本文： | 鲁凯,任春岭,高娜燕,丁荣峥.铜丝球键合工艺及可靠性机理[J].电子与封装,2010,10(2):1-6,10. |
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| 作者姓名： | 鲁凯 任春岭 高娜燕 丁荣峥 |
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| 作者单位： | 无锡中微高科电子有限公司,江苏,无锡,214035 |
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| 摘 要： | 文章针对铜丝键合工艺在高密度及大电流集成电路封装应用中出现的一系列可靠性问题,对该领域目前相关的理论和研究成果进行了综述,介绍了铜丝球键合工艺、键合点组织结构及力学性能、IMC生长情况、可靠性机理及失效模式。针对铜丝球键合工艺中易氧化、硬度高等难点,对特定工艺进行了阐述,同时也从金属间化合物形成机理的角度重点阐述了铜丝球键合点可靠性优于金丝球键合点的原因。并对铜丝球键合及铜丝楔键合工艺前景进行了展望。
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| 关 键 词： | 铜丝 键合工艺 可靠性 失效模式 |
The Process and Reliability Researches of Copper Wire Bonding |
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| LU Kai,REN Chun-ling,GAO Na-yan,DING Rong-zheng.The Process and Reliability Researches of Copper Wire Bonding[J].Electronics & Packaging,2010,10(2):1-6,10. |
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| Authors: | LU Kai REN Chun-ling GAO Na-yan DING Rong-zheng |
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| Affiliation: | Wuxi Zhongwei High-tech Electronics Co.;Ltd.;Wuxi 214035;China |
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| Abstract: | According to the reliability problems of copper wire bonding in fine-pitch and high current IC packaging, summarize the theory and experiment research in this field, describe the copper wire bonding process, microstructure of the copper bonding and its mechanical performance, status of IMC growth,reliability mechanism and failure mode. As there are oxidization and hardness problems in copper wire bonding, introduce the specialized technology to solve the problems. Expound the advantages of bonding reliabili... |
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| Keywords: | Cu wire ultrasonic ball bonding reliability failure mode |
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