键合拉力测试点对键合拉力的影响分析

随着现代封装技术的高速发展，对于封装产品质量的检测要求越来越严格，而键合拉力测试是封装产品质量检测中的重要一项，而在相关标准上并未对键合拉力测试点及键合线弧度对测量结果所产生的影响给出明确的规定。基于此，文章介绍了测量点位置、引线弧度、测量速度等因素对引线键合拉力测试准确性的影响。然后通过客观的分析提出了科学合理的键合强度测试的方法，为客观准确的测量键合拉力奠定了基础。

Analysis of the Influence of Test Point to Wire Bond Bulling Test

With the development of the package technology,it is more and more strict to check packaging products. Wire bond pulling test is very important in packaging product test. However,it isn’t shown that measuring result is affected by wire bond pulling test point position and wire radian. Hence,this Article introduces that some factors,such as wire radian,test point position,test speed,affect accu-racy of wire bond pulling test,we put forward adaptive method that tests wire bond strength by the analysis.