| Abstract: | Semiconductor packaging is sparking intense interest in ultra-thin packages in which the body thickness is less than 1mm. Most of this packaging development is taking place in the Far East and is being carefully monitored in the US. On the basis that most IC assembly and packaging is carried out in this region and market demand for the UTP is low, US companies are content with watching and waiting. Market interest in the US is high in the field of MCMs and this has created a large lobby for the KGD bandwagon. Are these two issues related? Does the Ultra-Thin Package (UTP) represent the best way of solving the IC interface with sub-systems or does it present more problems than the KGD philosophy? This feature looks at the available data on UTP and examines the various aspects of these vying approaches to increased packing densities. |
