探针扫描法快速测量半导体激光阵列Smile效应

为克服传统光学方法测量半导体激光阵列(LDA)Smile效应时存在的光学系统搭建精度要求高、测试人员素质要求高、后期数据处理繁杂测量时间长等缺点,通过用机械接触式台阶仪的探针扫描焊接后LDA芯片N面的方式,快速测量LDA的Smile效应,并将之与传统光学方法测量的Smile效应进行对比。结果表明,两者形态完全一致,差别小于1 m。用台阶仪测量LDA Smile效应耗时小于1 min。此方法能为芯片焊接工艺优化Smile效应提供快速反馈,可方便集成在大批量生产流水线中对LDA的Smile效应进行实时监测。

Smile effect of laser diode arrays measured by stylus scan method

Traditional optical methods which are used to measure the Smile effect of laser diode arrays(LDA) have problems such as high precision optical system setting up, high operator quality requirements, vast and complex subsequent data processing, long measuring time and so on. In this paper, a new method that scanned the N side of mounted LDA chips with the stylus of a mechanical contacting profiler was proposed to measure the Smile effect of LDA quickly. The measuring result was compared with the Smile effect measured by a traditional optical method. And the comparision indicates that their shapes are uniform and the difference is less than 1 micrometre. Using a profiler to measure the Smile effect of LDA takes little time less than 1 minute. The method can provide feedbacks quickly in chips bonding process to minimize the Smile effect, and can be easily integrated into high production lines to monitor the Smile effect of laser diode arrays in real time.