毫米波三维异质异构集成技术的进展与应用

三维异质异构集成技术是实现电子信息系统向着微型化、高效能、高整合、低功耗及低成本方向发展的最重要方法,也是决定信息化平台中微电子和微纳系统领域未来发展的一项核心高技术。文章详细介绍了毫米波频段三维异质异构集成技术的优势、近年来的发展趋势以及面临的挑战。利用硅基MEMS 光敏复合薄膜多层布线工艺可实现异质芯片的低损耗互连,同时三维集成高性能封装滤波器、高辐射效率封装天线等无源元件,还能很好地处理布线间的电磁兼容和芯片间的屏蔽问题。最后介绍了一款新型毫米波三维异质异构集成雷达及其在远距离生命体征探测方面的应用。

Recent Progress and Applications of Millimeter Wave 3-D Heterogeneous Integration Technology

Three-dimensional heterogeneous integration technology is the most important method to realize the development of electronic information systems towards miniaturization, high performance, high integration, low power consumption and low cost, and is also a core high-tech which determines the future development of microelectronics and micro-nano systems in the information platform. This paper introduces the advantages of 3D heterogeneous integration technology in the millimeter wave band, the development trend in recent years, and the challenges it faces. The fabrication process of our inhouse silicon-based MEMS photosensitive composite film is developed to provide very high-density integration and very low insertion loss of interconnections between chips. At the same time, three-dimensional integration of passive components such as high-performance packaged filters and high-radiation efficiency antenna-in-package can also be obtained. Finally, this paper introduces a novel millimeter-wave three-dimensional heterogeneous integrated radar and its application in long-distance vital sign detection.