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Demonstration of GaN MIS diodes by using AlN and Ga2O3(Gd2O3) as dielectrics
Authors:F Ren  CR Abernathy  JD MacKenzie  BP Gila  SJ Pearton  M Hong  MA Marcus  MJ Schurman  AG Baca  RJ Shul
Affiliation:

a Department of Chemical Engineering, University of Florida, P.O. Box 116005, Gainesville, FL 32611, USA

b Bell Laboratories, Lucent Technologies, Murray Hill, NJ 07974, USA

c EMCORE Inc., Somerset, NJ 07061, USA

d Sandia National Laboratory, Albuquerque, NM 87185, USA

Abstract:GaN MIS diodes were demonstrated utilizing AlN and Ga2O3(Gd2O3) as insulators. A 345 Å of AlN was grown on the MOCVD grown n-GaN in a MOMBE system using trimethylamine alane as Al precursor and nitrogen generated from a SVT RF N2 plasma. For the Ga2O3(Gd2O3) growth, a multi-MBE chamber was used and a 195 Å oxide was E-beam evaporated from a single crystal source of Ga5Gd3O12. The forward breakdown voltage of AlN and Ga2O3(Gd2O3) diodes are 5 and 6 V, respectively, which are significantly improved over not, vert, similar1.2 V from that of a Schottky contact. From the C–V measurements, both kinds of diodes showed good charge modulation from accumulation to depletion at different frequencies. The insulator/GaN interface roughness and the thickness of the insulator were measured with X-ray reflectivity.
Keywords:
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