化学机械抛光浆料研究进展

化学机械抛光(CMP)作为目前唯一可以实现全面平坦化的工艺技术,已被越来越广泛地应用到集成电路芯片、计算机硬磁盘和光学玻璃等表面的超精密抛光.介绍了CMP技术的发展背景,以及目前国内外抛光浆料的研究现状,并根据CMP浆料磨料的性质,将其分为单磨料、混合磨料和复合磨料浆料,对每一种浆料做了总体描述.详细介绍了近年来发展的复合磨料制备技术及其在CMP中的应用,并展望了CMP技术的发展前景以及新型抛光浆料的开发方向.

Research and Development of Chemical Mechanical Polishing Slurry

With the development of semiconductor industry and IC techniques, CMP becomes the most effective technique for achieving global planarization, and it is widely used for the manufacturing of ICs, hard disk, optical glass, etc. The background and recent development of CMP and polishing slurry are introduced. According to the characterization of polishing slurry and abrasive, the single abrasive slurry, mixed abrasives slurry and composite abrasive slurry are summarized. The recent preparation technology of composite abrasive and their applications in CMP are also introduced. Finally, the future prospect of CMP and the development trends of new types of polishing slurry are outlined.