| 表面贴装设备的性能检测 |
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| 引用本文： | 史长虹,汪劲松.表面贴装设备的性能检测[J].半导体技术,2003,28(8):15-17. |
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| 作者姓名： | 史长虹 汪劲松 |
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| 作者单位： | 清华大学深圳研究生院,广东,深圳,518057 |
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| 摘 要： | 论述表面贴装设备性能检测问题,帮助用户理解应用表面贴装设备行业标准IPC9850,提高对贴片设备评估、选择、维护、调整以及SMT工艺分析的能力。
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| 关 键 词： | IPC9850 表面贴装设备 检测 标准 |
| 文章编号： | 1003-353X(2003)08-0015-03 |
Performance measurement of surface mount assembly equipment |
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| SHI Chang-hong,WANG Jin-song.Performance measurement of surface mount assembly equipment[J].Semiconductor Technology,2003,28(8):15-17. |
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| Authors: | SHI Chang-hong WANG Jin-song |
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| Abstract: | In this paper, performance measurement of surface mount assembly equipment isdiscussed. It can be used to understand and apply IPC9850 standard, at the same time, can help usersto improve the capability on evaluation, choice, maintenance, adjustment, and process analysis ofsurface mount assembly equipment. |
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| Keywords: | IPC9850 surface mount assembly equipment measurement standard |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
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