| ULSI中铜互连线通孔电热性能的数值模拟 |
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| 引用本文： | 李志国,卢振钧.ULSI中铜互连线通孔电热性能的数值模拟[J].电子学报,2003,31(7):1104-1106. |
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| 作者姓名： | 李志国 卢振钧 |
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| 作者单位： | 北京工业大学电子信息与控制工程学院,北京 100022 |
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| 基金项目： | 国家自然科学基金 (No .699360 2 0 ) |
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| 摘 要： | 利用三维有限元模型对Cu互连线通孔进行了电流密度、温度和温度梯度的分布进行了模拟,比较了具有不同阻挡层材料的通孔内的电流密度、温度和温度梯度的分布.对于同一阻挡层材料,进行了不同通孔倾斜角的模拟.模拟结果指出,通过优化通孔倾斜角和优选阻挡层材料可有效地改善通孔内的电流密度和温度的分布,提高ULSI通孔互连的可靠性,这对通孔的设计提供了有益的参考.
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| 关 键 词： | 铜互连线 通孔 有限元 阻挡层材料 |
| 文章编号： | 0372-2112(2003)07-1104-03 |
| 收稿时间： | 2001-11-15 |
Numerical Simulation of Electric and Thermal Characteristic in ULSI Copper-Filled Inteconnect Via Hole |
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| LI Zhi-guo,LU Zhen-jun.Numerical Simulation of Electric and Thermal Characteristic in ULSI Copper-Filled Inteconnect Via Hole[J].Acta Electronica Sinica,2003,31(7):1104-1106. |
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| Authors: | LI Zhi-guo LU Zhen-jun |
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| Affiliation: | The School of Electronics and Control Engineering,Beijing Polytechnic University,Beijing 100022,China |
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| Abstract: | Three-dimension finite element modeling has been used to simulate and compare the current density,temperature and the gradients of distribution in Copper-filled via hole structure.To the same barrier material,the via hole with different slope has been simulated.The result of the simulation shows that optimizing the slope of the via hole and selecting the barrier material will improved the interconnect reliabiling.All these provide valuable reference to the design of the via hole. |
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| Keywords: | Cu interconnect via finite element barrier material |
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