| 球栅阵列器件焊接合格率预测及缺陷分析 |
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| 引用本文： | 魏鹤琳,王奎升.球栅阵列器件焊接合格率预测及缺陷分析[J].电子元件与材料,2007,26(5):62-65. |
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| 作者姓名： | 魏鹤琳 王奎升 |
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| 作者单位： | 北京化工大学机电工程学院,北京,100029 |
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| 摘 要： | 应用数理统计结合工艺设计、制造工艺控制参数等因素及Surface Evolver软件仿真技术的方法,建立球栅阵列(BGA)器件焊接合格率的预测模型,运用该模型可以找出影响焊接合格率的制约因素。结合仿真技术模拟焊点形态,可以找出造成焊点缺陷时各参数之间的关系并提出相应的解决方案,从而优化工艺设计及制造工艺控制参数。
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| 关 键 词： | 半导体技术 球栅阵列 焊接合格率 数理统计模型 焊接缺陷 焊点形态 |
| 文章编号： | 1001-2028（2007）05-0062-04 |
| 修稿时间： | 2007-01-12 |
Prediction of BGA solder yield and analysis of solder defects |
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| WEI He-lin,WANG Kui-sheng.Prediction of BGA solder yield and analysis of solder defects[J].Electronic Components & Materials,2007,26(5):62-65. |
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| Authors: | WEI He-lin WANG Kui-sheng |
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| Affiliation: | College of Mechanical and Electrical Engineering, Beijing University of Chemical Technology, Beijing 100029, China |
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| Abstract: | By mathematical statistics based on the manufacturing process variations and variations of component and PCB, using the software of surface Evolver simulation, mode of BGA solder yield predictor was built. Using the mode and simulating the solder joint shapes, find the root cause of solder defects identify the relationship of designand process parameters, suggest design improvemet. |
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| Keywords: | semiconductor ball grid array(BGA) solder yield mathematical statistical model solder defect solder joint shape |
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