环氧树脂–银粉复合导电银浆的制备

导电油墨(导电银浆等)是以全印制电子技术制作印制电路板的关键材料。研究了以环氧树脂为连结剂、自制超细银粉为填料、聚乙二醇等材料为添加剂的复合导电银浆配方及制备方法。研究获得的最佳配方为:w(银粉)为70%～80%,其他各组分之间的质量比ζ(环氧树脂∶四氢呋喃∶固化剂∶聚乙二醇)=1.00∶(2.00～3.00)∶(0.20～0.30)∶(0.05～0.10)。在最佳配方范围内,复合导电银浆室温固化后电阻率小于100Ω/cm,有机物挥发少,对环境友好,符合实际应用要求。

Preparation of epoxy-silver composite conductive silver paste

Conductive inks(conductive silver paste,etc.) are critical to the manufacturing of printed circuit board(PCB) using the printed electronics technology.The composition and the preparation process of the conductive silver paste with epoxy resin as the substrate,self-made ultrafine silver powder as the filler and polyethylene glycol as well as other materials as the additive were investigated in this study.When 70%～80%(mass fraction) of silver powder is included and the mass ratio of epoxy resin/tetrahydrofuran/curing agent/polyethylene glycol is 1.00:(2.00～3.00):(0.20～0.30):(0.05～0.10),the conductive silver pastes show the best performance.These pastes cure at room temperature,show a resistivity smaller than 100Ω/cm after curing and are environmentally friendly with low organic materials emission,meeting the requirements of practical applications.