| 简化热传导模型与再流焊参数分析 |
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| 引用本文： | 刘旭朝,贾建援,刘哲,付红志,王世堉.简化热传导模型与再流焊参数分析[J].电子工艺技术,2012(6):335-340. |
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| 作者姓名： | 刘旭朝 贾建援 刘哲 付红志 王世堉 |
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| 作者单位： | [1]西安电子科技大学,陕西西安710071 [2]中兴通讯,广东深圳518057 |
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| 基金项目： | 2011产学研合作基金项目 |
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| 摘 要： | 再流焊接工艺作为SMT生产线上的核心工艺环节,其质量与效率的提高集中体现在再流焊温度曲线的优化与控制上。再流焊焊接工艺仿真与预测研究越来越受到关注。提出了再流焊焊接工艺仿真简化模型,将其应用于计算机辅助分析中,预测再流焊温度曲线,辅助工艺制定。
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| 关 键 词： | PoP 再流曲线 工艺仿真 热传导 |
Simplified Model of Heat Transfer and Analysis of Reflow Soldering Parameters |
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| LIU Xu-zhao,JIA Jian-yuan,LIU Zhe,FU Hong-zhi,WANG Shi-.Simplified Model of Heat Transfer and Analysis of Reflow Soldering Parameters[J].Electronics Process Technology,2012(6):335-340. |
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| Authors: | LIU Xu-zhao JIA Jian-yuan LIU Zhe FU Hong-zhi WANG Shi- |
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| Affiliation: | 1 Xidian University,Xi’an 710071,China;2 ZTE Corporation,Shenzhen 518057,China) |
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| Abstract: | As the crucial process in SMT line,the perfection of the quality and efficiency of the reflow soldering process relies on the optimization and control of the reflow profile.The simulation and prediction of reflow soldering process is increasingly concerned.Describe a new simplified reflow soldering process model,which will be applied to the computer-aided analysis and predict the reflow profile,assisting the reflow soldering process formulation. |
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| Keywords: | PoP Reflow profile Simulation Heat conduction |
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