| 再流焊焊点可靠性自动管理系统 |
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| 引用本文： | 史建卫,梁永君,区大公,柴勇.再流焊焊点可靠性自动管理系统[J].电子工艺技术,2007,28(2):78-83. |
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| 作者姓名： | 史建卫 梁永君 区大公 柴勇 |
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| 作者单位： | 日东电子科技(深圳)有限公司,广东,深圳,518103 |
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| 摘 要： | 加热因子Q是描述SMT再流焊过程的一个量化参数,决定了再流焊工艺以及焊点的可靠性,其大小直接反映了焊点的吸热量以及焊接界面形成的金属间化合物的形态.通过自动再流焊管理系统(ARM)对温度曲线进行监控和优化,调整加热因子,实现可靠的产品焊接.
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| 关 键 词： | 加热因子 焊点可靠性 温度曲线 金属间化合物 自动再流焊管理系统 |
| 文章编号： | 1001-3474（2007102-0078-06 |
| 修稿时间： | 2007-01-08 |
Automatic Management System of Solder Joint Reliability in Reflow Soldering |
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| SHI Jian-wei,LIANG Yong-jun,OU Da-gong,CHAI Yong.Automatic Management System of Solder Joint Reliability in Reflow Soldering[J].Electronics Process Technology,2007,28(2):78-83. |
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| Authors: | SHI Jian-wei LIANG Yong-jun OU Da-gong CHAI Yong |
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| Affiliation: | Sun East Electronic Technology (Shen Zhen |
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| Abstract: | Heating gene Q is a quantitative parameter. It describers a process of reflow soldering and dominates technology of reflow soldering and reliability of solder joints, denots quantity of absorbed heating for solder joint and modality of interracial IMC between solder and pad. Controlling and optimizing thermal profile to adjust beating gene by automatic reflowing management system for getting complete solder result. |
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| Keywords: | Heating gene Reliability of solder Joint Thermal profile Intermetallic compound(IMC) Automatic reflowing management(ARM) system |
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